![]() Instrument for analysis of solid body specimen
专利摘要:
This invention relates to electron and ion microscopy. A device for microanalysis of a sample of a solid body contains in a vacuum chamber 18 a source of primary ions 9, electrostatic systems 10, 4 of forming an ion probe, a system 15 of scanning an ion probe, a moving object holder 7 whose plane is perpendicular to the first optical axis, a system 13 of focusing secondary ions , an ion analyzer, including a mass spectrometer 14, electrostatic systems 11 and 12, turn the ion probe and the secondary ion beam, respectively, a system 3 for separating the ion probe and the secondary ion beam c, a synchronous dynamic correction system of the secondary ion beam system 16, an electron gun 1, a focusing terminal system 6, a secondary electron detector 17, an electron probe scanning system 5, an electron probe formation magnetic system 2. The description of the invention indicates the mutual arrangement of the elements of the device and their design. The instrument allows microanalysis by simultaneously observing ionic and electronic images., 5 e.p. f-ly, 3 ill. § к | ;; ь о о о о Figs. 公开号:SU1407409A3 申请号:SU853995145 申请日:1985-12-27 公开日:1988-06-30 发明作者:Слодзьян Жорж;Дэнье Бернар;Жирар Франсуа 申请人:Оффис Насьональ Дъэтюд Э Де Решерш Аэроспасьаль О.Н.Э.Р.А. (Фирма); IPC主号:
专利说明:
The invention relates to electron and ion microscopy and can be used to study and analyze samples of a solid by radiation methods. The aim of the invention is to expand the functional capabilities of the microanalysis device by simultaneously observing ionic and electronic images while reducing the size of the device. Fig. 1 shows a block diagram of the device proposed in Fig. 2 — an electron-optical diagram of the device; on fig.Z - scheme of the terminal focus system. Sphig are located along the first optical axis of the device, 3) electron gun 1, electron probe formation system 2, ion probe and secondary ion separation system 3, second electrostatic probe formation system A, ion probe system 5, electron probe scanning, terminal system 6 focusings and a movable object holder 7 with sample 8 "Along the second optical axis, parallel to the first, in the direction opposite to) M in the direction of the electron probe, to along the ion probe Therefore, the source of 9 primary ions is consistently distributed, the first electrostatic system 10 | stabilizes the ion current and the electrostatic system iI turns the ion probe. Along the third optical axis parallel to the first two, along the beam of secondary ions, there are successively arranged an electrostatic system 12 of the secondary beam reversal: horses 5 secondary ion focusing system 13 and an ion analyzer including a 14 ”mass spectrometer Between the 1I turn-around ion probe system and the system 3 the ion probe and secondary ions are placed the scanning system 15 of the ion probe and between the system 12 the turn of the secondary ion beam and the separation system 3 is placed the system 16 of the synchronous dynamic correction tion: PU .ka secondary ions. Systems: 15 and 16 are displaced from the first optical axis to the second and third optical axis. Before entering S, the system 3 for separating the ion probe and the beam of secondary ions is set offset from the first opto 0 five 0 The C-axis detector is 17 secondary electrons. All systems are placed in a vacuum chamber 18, the cavity of which is connected to vacuum pumps 19. The ion probe formation system 10 comprises (FIG. 2) three successively arranged first forming lenses 20, 21 and 22, as well as plates 23 for adjusting and correcting astigmatism. The ion probe reversal system 1 and the secondary ion beam reversal system 12 each comprise two deflecting sectors 24, between which the first matching electrostatic lens 25 is placed in the system 11, and the slit diaphragm 26 and the second matching electrostatic lens 27 are placed in the system 12 The ion probe is made in the form of two pairs of deflecting plates in the same way as the system 16 of synchronous dynamic correction of the secondary ion beam, but the plates of the latter are included in antiphase to the system 15 of the scanning of the ion probe. The second electrostatic system 4 for forming the ion probe contains the second formating lenses 28, 29, and 30, the System 5 scanning the 1-e electron probe is implemented in the form of mag HHTiibix coils 3) and 32. The end focusing system 6 (FIG. 3) comprises a focusing electrostatic lens 33, a diaphragm 38, a secondary secondary electron focusing lens 35, a grounded ring electrode 36, a control electrode 37, a pull electrode 38 and electrically connected with the object holder 7, the screening electrode 39, Electrodes of the image, that near optical system 40, the System 13 of the secondary ion focusing () includes a set of electrostatic lrns, a centrier-treated plate 41 and the second piTro slit aperture 42, The device works as follows Primary ions have a positive sign, predominantly those of cesium or potassium. Secondary ions are, in principle, equivalent. Primary ions also cause secondary electron emission 1-ο. When a sample of the primary electrons is exposed to an electron probe, a stream of secondary electrons is formed. Pervich - 140 The ions and electrons are directed to a common optical part, combining systems 3-6 (figure 1). A beam of secondary ions passes through the same optical part and is directed to the mass spectrometer 14, and the flow of secondary electrons detected by the detector 1 7. The ion probe is formed by the first electrostatic lenses 20-22 and is corrected by means of plates 23 for adjusting and correcting astigmatism. Next, the primary ion beam enters one of the deflecting sectors 24. After a deflection of 90, the first matching electrostatic lens 25 directs the ion beam to another deflection sector, in which the beam is deflected by 84. The plates of the separation system of the ion probe and the secondary ion beam additionally deflect the primary ion beam by 6 and lead it to the first optical axis. The ion probe is scanned by system 5 by electrostatic deflection. Further, along the first optical axis, a beam of primary ions is formed mainly by the second forming lens 29 ,. part of the second ion probe formation system 4. The middle optical system 40 determines the final reduced image of the source of primary ions on the sample surface. The second shaping lens 29 forms the prossover of the ion probe in the center of the diaphragm 34, relative to which the ion probe is rotated during scanning without affecting the electron probe and secondary beams. The final focusing adjustment is performed with the help of an electrode 38. At the same time, the shielding electrode 39 reduces the field effect of the electrode 38 on the sample potential. Middle optical system 40 brings the ion energy of the ion probe to 15 keV. The resulting secondary ions have an energy of no more than 5 keV, obtained by the action of the potential difference between the sample and the grounded ring electrode 36. In this case, the forming beam of secondary ions is a stretching electrode 38. The screening electrode 39 and the negative control electrode also contribute to the focusing of the secondary ions five 409 37. The action of the focusing electrodes is such that a secondary ion image is formed in the plane of the diaphragm 34 (FIG. 3). In the ion probe formation system 4, a secondary ion beam is exposed to lenses 29 and 30, which form intermediate images. B system 3 10, primary positive ions with an energy of about 10 keV and negative secondary ions with an energy of about 5 keB are separated. The latter are deflected at an angle of 12. After 15 separation secondary ion beam subjected to out-of-phase scanning in system 16 by synchronous dynamic correction to match its reception with a mass spectrometer. One deflection sector 24 installed in the path of the secondary ion beam from –70 ° clone em it on / o, and the other - on 90. At the same time, the second matching lens 27 is positioned so that it creates an achromatic focus resulting from the joint operation of system 3 and deflecting sectors, producing an angular magnification that eliminates the chromatic effect at the output of the second deflecting sector. The slit diaphragm 26 provides energy filtering of secondary ions to set the energy band of the mass spectrometer. The lenses of the secondary ion focusing system 13 narrow the beam at the level of the second slit diaphragm 42, and the plates 41 center the beam relative to the entrance B of the mass spectrometer 14. 40 An electronic probe formed by the electron gun 1 and the formation system 2 is guided along the first optical axis to the separation system 3. On the electric field plates 45 ion separation is superimposed by a magnetic field compensating for the thin deflection effect of these plates on the primary electrons. The secondary electrons in this field will deviate, since they have different energy from the primary electrons. Along the deflected trajectory of the secondary electron; enter detector 17. Among the second lens forming system 4, lens 28 is a magnet35 50 55 and transfers the beam of primary electrons to the last magnetic lens 35 of the terminal focusing system 6. At the same time, the diaphragm 34 limits 3 1 / divergence of this bundle. The magnetic coils 3 and 32 of the system 5 scanning the electronic probe provide centering, distance, and correction of the probe astigmatism. The magnetic field of these coils has virtually no effect on the trajectories of the primary and secondary ions. The magnetic lens 35 has a stronger focusing effect on the resulting secondary electrons than on the primary electrons. At the same time, ionic and electronic images are not superimposed on each other and are not located exactly in one place. This is also achieved by a corresponding polarization of the control electrode 37. Next, the secondary electrons along the first optical axis reach the separation system 3 and are deflected by the detector 17. Thus, the electron-optical system of the device as a whole is constructed in such a way that the choice of the energy values of various particles in combination with the different signs of the charges of the primary and secondary ions allows adjustment of each beam independently of the adjustment of other beams. In particular, the magnetic lenses of the device provide the focusing of primary electrons, but they have a very weak effect on ion beams, electrostatic lenses that are positively polarized, act on positive primary ions, but their effect on negative secondary ions or secondary electrons is much more harmful. It is also possible to use negative primary ions, however in this case it is impossible to simultaneously obtain an ionic image and an image in secondary electrons, since the latter are retained on the surface of the sample due to its positive polarization. When examining samples of small thickness by the principle of x-ray transmission, in all cases it is possible to simultaneously obtain images in secondary negative: and positive ions.
权利要求:
Claims (6) [1] 1. An instrument for microanalysis of a sample of a solid containing in the vacuum chamber a source of primary ion7- () 9 ° a new, first HOFHioro electrostatic probe formation system, an ion probe scanning system, a secondary electrostatic ion probe formation system, a movable object holder whose plane is perpendicular to the first optical axis, and a focusing system 10 secondary ions and an ion analyzer, including a mass spectrometer, characterized in that, in order to expand functionality due to simultaneous observation of ion and electronic images while reducing the size of the device, it is additionally equipped with two electrostatic systems of reversal of the ion probe and beam 20 secondary ions 5 by a separation system of an ion probe and a secondary ion beam and a system of synchronous dynamic correction of a secondary ion beam, as well as an electron gun, a magnetic system for forming an electronic probe, an electron scanning system of the probe, an end focusing system and a secondary electron detector 30 gun, electron probe formation system, ion probe and secondary ion separation system with a center of rotation of primary and secondary ions at the level of the pro2 sover image, second electrostatic ion probe formation system, electronic probe scanning system, final focusing system and mobile object holder afterwards 40 located along the electron probe along the first optical axis, parallel to which along the second optical axis in the direction opposite to the direction of travel 45 the electron probe and the source of primary ions are successively arranged along the ion probe, the first electrostatic system of forming the ion probe and the electrostatic system of the turn of the ion probe and along the third optical axis parallel to the first and second optical axes located gg is an electrostatic system of reversal of the secondary ion beam, a system for focusing secondary ions and an ion analyzer, while the scanning system of the ion probe and the synchronous system Dynamic correction of the secondary ion beam is located between the respective reversal systems and the separation system of the ion probe and secondary ion beam and is shifted from the first optical axis to the second and third optical axes, respectively, and the secondary electron detector is set4. Apparatus according to claims 1-3, about tl and - due to the fact that each of the electrostatic reversal systems of the ion probe and secondary ion beam is implemented in the form of two consecutive deflecting sectors, while in the interval between the deflecting sectors of the system flax in front of the entrance to the said system -JQ reversal of the ion probe is placed separation and offset from the first optical axis. [2] 2. POP.1 instrument, characterized in that the final focusing system contains an electrostatic lens, a diaphragm, a magnetic focusing lens of the secondary electrons, a grounded ring electrode, a control electrode, a pulling electrode, and an electrically connected electrically arranged in series along the electron and ion probes. with object holder screening electrode. [3] 3. The device according to claims 1 and 2, which is based on the fact that the system of synchronous dynamic correction of the secondary ion beam is made in the form of two pairs of deflecting plates, including in antiphase with respect to the scanning system of the ion probe. [4] the first matching electrostatic lens, and in the gap between the deflecting sectors of the reversal system of the secondary ion beam, the slit diaphragm and the second matching electrostatic lens are placed successively along the beam. [5] 5. The device according to claims 1-4, which is equipped with an additional deflecting sector, located between the separation system of the ion probe and the secondary ion beam and the secondary electron detector. [6] 6. The device according to claims 1-5, about tl and - 4 ayy with the fact that the system the separation of the ion probe and the secondary ion beam is designed as an electrostatic deflection system. ((j
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同族专利:
公开号 | 公开日 JPS61277145A|1986-12-08| DE3575046D1|1990-02-01| EP0188961B1|1989-12-27| FR2575597B1|1987-03-20| EP0188961A1|1986-07-30| US4694170A|1987-09-15| FR2575597A1|1986-07-04|
引用文献:
公开号 | 申请日 | 公开日 | 申请人 | 专利标题 FR1352167A|1962-11-28|1964-02-14|Ct Nat De La Rech Scient Et Cs|New device for microanalysis by secondary ionic emission| US3445650A|1965-10-11|1969-05-20|Applied Res Lab|Double focussing mass spectrometer including a wedge-shaped magnetic sector field| DE1937482C3|1969-07-23|1974-10-10|Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V., 3400 Goettingen|Microbeam probe| DE2223367C3|1972-05-12|1978-11-30|Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften E.V., 3400 Goettingen|Micro-beam probe for the quantitative detection of charged secondary particles| DE3144604A1|1981-11-10|1983-05-19|Leybold-Heraeus GmbH, 5000 Köln|Apparatus for examining a sample| DE3231036C2|1982-08-20|1992-09-17|Max-Planck-Gesellschaft Zur Foerderung Der Wissenschaften Ev, 3400 Goettingen, De| GB8401471D0|1984-01-19|1984-02-22|Cleaver J R A|Ion and electron beam electrostatic lens systems| US4564758A|1984-02-01|1986-01-14|Cameca|Process and device for the ionic analysis of an insulating sample|IE58049B1|1985-05-21|1993-06-16|Tekscan Ltd|Surface analysis microscopy apparatus| JPS62223957A|1986-03-26|1987-10-01|Hitachi Ltd|Hybrid charged particle optical system| US4829179A|1986-07-12|1989-05-09|Nissin Electric Company, Limited|Surface analyzer| DE3638682A1|1986-11-13|1988-05-19|Siemens Ag|SPECTROMETER LENS FOR CARPUSULAR BEAM MEASUREMENT TECHNOLOGY| US4818872A|1987-05-11|1989-04-04|Microbeam Inc.|Integrated charge neutralization and imaging system| US4870352A|1988-07-05|1989-09-26|Fibertek, Inc.|Contactless current probe based on electron tunneling| JP2714009B2|1988-07-15|1998-02-16|株式会社日立製作所|Charged beam device| JP2811073B2|1988-11-01|1998-10-15|セイコーインスツルメンツ株式会社|Cross section processing observation device| JPH03245447A|1990-02-23|1991-11-01|Hitachi Ltd|Converged cesium ion beam formation method| JP2586710B2|1990-09-07|1997-03-05|日本電気株式会社|Secondary ion mass spectrometry| JP2676120B2|1991-06-17|1997-11-12|シャープ株式会社|Beam adjustment method for charged particle beam analyzer| US5564623A|1993-06-11|1996-10-15|American Trading And Production Corporation|Durable case formed from an expanded high-density polyethylene| DE19828741A1|1998-06-27|1999-12-30|Leo Elektronenmikroskopie Gmbh|Electron microscope with an imaging magnetic energy filter| US6774990B2|2002-08-23|2004-08-10|Intel Corporation|Method to inspect patterns with high resolution photoemission| JP2005005125A|2003-06-11|2005-01-06|Hitachi High-Technologies Corp|Charged particle beam device| EP2579272A1|2003-09-05|2013-04-10|Carl Zeiss SMT GmbH|Particle-optical systems and arrangements and particle-optical components for such systems and arrangements| GB0624677D0|2006-12-11|2007-01-17|Shimadzu Corp|A co-axial time-of-flight mass spectrometer| EP2122655A2|2007-02-22|2009-11-25|Applied Materials Israel Ltd.|High throughput sem tool| US7884316B1|2007-03-21|2011-02-08|Saint-Gobain Ceramics & Plastics, Inc.|Scintillator device| JP4977509B2|2007-03-26|2012-07-18|株式会社日立ハイテクノロジーズ|Scanning electron microscope| EP2006881A3|2007-06-18|2010-01-06|FEI Company|In-chamber electron detector| US20110163068A1|2008-01-09|2011-07-07|Mark Utlaut|Multibeam System| US7829857B2|2008-04-17|2010-11-09|Menge Peter R|Radiation detector device| US7820974B2|2008-04-18|2010-10-26|Saint-Gobain Ceramics & Plastics, Inc.|Scintillation detector and method of making| US20090309021A1|2008-06-17|2009-12-17|El-Mul Technologies Ltd.|Ion detection method and apparatus with scanning electron beam| WO2014210407A1|2013-06-28|2014-12-31|Saint-Gobain Ceramics & Plastics, Inc.|Scintillation detector| JP6554066B2|2016-05-31|2019-07-31|株式会社日立製作所|Electron microscope for magnetic field measurement and magnetic field measurement method|
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申请号 | 申请日 | 专利标题 FR8420053A|FR2575597B1|1984-12-28|1984-12-28|APPARATUS FOR VERY HIGH RESOLUTION ION MICROANALYSIS OF A SOLID SAMPLE| 相关专利
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